The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2019

Filed:

May. 22, 2017
Applicant:

C. Uyemura & Co., Ltd., Osaka, JP;

Inventors:

Masayuki Utsumi, Osaka, JP;

Hisamitsu Yamamoto, Osaka, JP;

Syunsaku Hoshi, Osaka, JP;

Junji Mizumoto, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 4/12 (2016.01); B05C 3/09 (2006.01); B05B 12/16 (2018.01); C23C 4/02 (2006.01); C23C 4/04 (2006.01); B05B 13/02 (2006.01); B05B 1/04 (2006.01); B05B 15/58 (2018.01);
U.S. Cl.
CPC ...
C23C 4/12 (2013.01); B05B 12/16 (2018.02); B05B 13/0264 (2013.01); B05C 3/09 (2013.01); C23C 4/02 (2013.01); C23C 4/04 (2013.01); B05B 1/044 (2013.01); B05B 15/58 (2018.02);
Abstract

A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrateis sandwiched and held by a clipof a hanger. A pipeas a treatment solution releasing section is provided on each side of the substratethat is held by the hanger. This pipeis provided with a holefrom which the treatment solution is released obliquely upward. The released treatment solution flows down on a surface of the substrate, reaches a lower portion thereof, is circulated by a pump, and is released from the pipeagain.


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