The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Oct. 22, 2015
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Michael E. Watts, Scottsdale, AZ (US);

Jeffrey K. Jones, Chandler, AZ (US);

Ning Zhu, Chandler, AZ (US);

Iouri Volokhine, Plaisance-du-Touch, NL;

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03F 1/56 (2006.01); H03F 3/195 (2006.01); H01G 4/30 (2006.01); H01G 4/38 (2006.01); H01L 23/66 (2006.01); H01F 27/28 (2006.01); H01G 4/005 (2006.01); H01G 4/12 (2006.01); H03F 3/213 (2006.01); H03H 7/38 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01); H01G 4/40 (2006.01);
U.S. Cl.
CPC ...
H03F 1/565 (2013.01); H01F 27/2804 (2013.01); H01G 4/005 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01); H01G 4/38 (2013.01); H01G 4/385 (2013.01); H01L 23/66 (2013.01); H01L 24/00 (2013.01); H01L 24/49 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H03H 7/38 (2013.01); H05K 1/111 (2013.01); H01F 2027/2809 (2013.01); H01G 4/40 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6661 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/4811 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/00015 (2013.01); H03F 2200/222 (2013.01); H03F 2200/451 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10166 (2013.01);
Abstract

A device includes multiple ceramic capacitors and a current path structure. A first ceramic capacitor includes a first ceramic material between first and second electrodes. A second ceramic capacitor includes a second ceramic material between third and fourth electrodes. The second ceramic material has a higher Q than the first ceramic material. The current path structure includes a lateral conductor located between the first and second ceramic materials, and first and second vertical conductors that extend from first and second ends of the lateral conductor to a device surface. The device may be coupled to a substrate of a packaged RF amplifier device, which also includes a transistor. For example, the device may form a portion of an output impedance matching circuit coupled between a current carrying terminal of the transistor and an output lead of the RF amplifier device.


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