The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Mar. 08, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Kenji Ouchi, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01J 37/32 (2006.01); C23C 16/04 (2006.01); C23C 16/30 (2006.01); C23C 16/455 (2006.01); C23C 16/509 (2006.01); C23C 16/515 (2006.01); C23C 16/513 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02131 (2013.01); C23C 16/04 (2013.01); C23C 16/30 (2013.01); C23C 16/45523 (2013.01); C23C 16/509 (2013.01); C23C 16/515 (2013.01); H01J 37/3211 (2013.01); H01J 37/32449 (2013.01); H01L 21/02211 (2013.01); H01L 21/02274 (2013.01); C23C 16/513 (2013.01); H01J 37/32467 (2013.01); H01J 37/32724 (2013.01); H01J 2237/334 (2013.01); H01J 2237/3321 (2013.01); H01L 21/6833 (2013.01);
Abstract

A film forming method for a target object including a main surface and grooves formed in the main surface, includes a step of supplying of a first gas into the processing chamber, and a step of supplying a second gas and a high frequency power for plasma generation into the processing chamber to generate in the processing chamber a plasma of a gas including the second gas in the processing chamber. The first gas contains an oxidizing agent that does not include a hydrogen atom. The second gas contains a compound that includes one or more silicon atoms and one or more fluorine atoms and does not include a hydrogen atom. A film containing silicon and oxygen is selectively formed on the main surface of the target object except the grooves.


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