The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2019
Filed:
Dec. 21, 2018
Applicant:
Foxconn Interconnect Technology Limited, Grand Cayman, KY;
Inventors:
Terrance F. Little, Fullerton, CA (US);
An-Jen Yang, Irvine, CA (US);
Jim Zhao, Irvine, CA (US);
Yuan Zhang, Rowland-Heights, CA (US);
Assignee:
FOXCONN INTERCONNECT TECHNOLOGY LIMITED, Grand Cayman, KY;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/26 (2006.01); G02B 6/42 (2006.01); H01L 23/467 (2006.01); H01R 12/72 (2011.01); H01R 24/00 (2011.01); H05K 7/20 (2006.01); H05K 13/04 (2006.01); H05K 5/00 (2006.01); H01R 13/66 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4269 (2013.01); H01L 23/467 (2013.01); H01R 12/721 (2013.01); H01R 24/00 (2013.01); H05K 5/0047 (2013.01); H05K 7/20409 (2013.01); H05K 7/20445 (2013.01); H05K 13/0486 (2013.01); H01R 13/6658 (2013.01);
Abstract
A plug connector includes: a metallic enclosure enclosing a printed circuit board; a heat sink member exposed to an exterior surface of the metallic enclosure; and a set of electronic components assembled upon the printed circuit board, wherein the heat sink member is to dissipate heat from at least one of the set of electronic components, and the heat sink member is detachably attached upon the metallic enclosure.