The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2019
Filed:
Sep. 14, 2016
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;
Inventors:
Yoichiro Kurita, Tokyo, JP;
Hideto Furuyama, Kanagawa, JP;
Hiroshi Uemura, Kanagawa, JP;
Fumitaka Ishibashi, Kanagawa, JP;
Assignee:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/13 (2006.01); G02B 6/32 (2006.01); G02B 6/34 (2006.01); G02B 6/36 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4243 (2013.01); G02B 6/131 (2013.01); G02B 6/32 (2013.01); G02B 6/4204 (2013.01); G02B 6/425 (2013.01); G02B 6/34 (2013.01); G02B 6/3644 (2013.01); G02B 6/4214 (2013.01); G02B 6/4239 (2013.01);
Abstract
According to one embodiment, an optical device includes an optical element and a via. The optical element is provided directly on a second main surface opposed to a first main surface of a semiconductor substrate. The via is aligned with the optical element and formed to extend halfway in a thickness direction from the first main surface of the semiconductor substrate.