The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Sep. 08, 2017
Applicant:

National Chiao Tung University, Hsinchu, TW;

Inventors:

Tuo-Hung Hou, Hsinchu, TW;

Jyun-Hong Huang, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/02 (2006.01); C23C 16/50 (2006.01); C23C 16/56 (2006.01); C23C 16/52 (2006.01); C23C 16/448 (2006.01); C23C 14/58 (2006.01); C23C 14/24 (2006.01); C23C 14/06 (2006.01); C23C 14/34 (2006.01); C23C 28/04 (2006.01);
U.S. Cl.
CPC ...
C23C 16/50 (2013.01); C23C 14/0623 (2013.01); C23C 14/0635 (2013.01); C23C 14/0641 (2013.01); C23C 14/24 (2013.01); C23C 14/34 (2013.01); C23C 14/5806 (2013.01); C23C 16/448 (2013.01); C23C 16/52 (2013.01); C23C 16/56 (2013.01); C23C 28/04 (2013.01);
Abstract

A fabrication method for two-dimensional materials of the present invention includes the following steps: forming a thin film having at least one two-dimensional element on a substrate; forming at least one capping layer on the thin film; annealing the thin film to form a two-dimensional material film after the capping layer is formed.


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