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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10428239 B1

PDFFull Text
Date of Patent:
Oct. 01, 2019

Filed:

Apr. 03, 2017

Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Kazunori Kondo, Takasaki, JP;

Yoichiro Ichioka, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Marc S Zimmer

Int. Cl.
CPC ...
C09D 183/06 (2006.01); C08G 77/14 (2006.01); C08G 59/42 (2006.01); C08K 3/36 (2006.01); C08K 7/18 (2006.01); C08L 63/00 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); C08G 77/52 (2006.01); C09D 183/14 (2006.01); C08G 77/42 (2006.01); C08L 83/14 (2006.01);
U.S. Cl.
CPC ...
C09D 183/06 (2013.01); C08G 59/42 (2013.01); C08G 77/14 (2013.01); C08G 77/42 (2013.01); C08G 77/52 (2013.01); C08K 3/36 (2013.01); C08K 7/18 (2013.01); C08L 63/00 (2013.01); C08L 83/14 (2013.01); C09D 183/14 (2013.01); H01L 21/56 (2013.01); H01L 23/295 (2013.01); H01L 23/296 (2013.01); H01L 23/31 (2013.01);
Abstract

The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000; (B) an epoxy resin-curing agent; and (C) a filler; wherein the mass fraction of the component (C) is 50 to 95% by mass based on the total mass. This can provide a resin composition that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably.

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