The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2019

Filed:

Feb. 13, 2018
Applicants:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;

Inventors:

Ji Quan Liu, Shanghai, CN;

Chun Lei Gong, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/01 (2006.01); H01L 31/0392 (2006.01); H01L 27/12 (2006.01); H01L 21/762 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01); H01L 21/84 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1207 (2013.01); H01L 21/762 (2013.01); H01L 21/7624 (2013.01); H01L 21/76248 (2013.01); H01L 21/823431 (2013.01); H01L 21/845 (2013.01); H01L 27/1211 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01); H01L 29/78603 (2013.01);
Abstract

Semiconductor structures are provided. A semiconductor structure includes a bottom substrate having a first region and a second region; an insulation layer formed on the bottom substrate in the first region; a top substrate on side surface of the trench and the insulation layer; a first fin portion formed over the insulation layer, and a gate structure crossing the first fin portion. The first fin portion is electrically isolated from the bottom substrate through the insulation layer to reduce the leakage current at the bottom of the first fin portion. The gate structure covers part of side and top surfaces of the first fin portion.


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