The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2019

Filed:

Dec. 22, 2017
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Nancy M. Lomeli, Boise, ID (US);

Tom George, Boise, ID (US);

Jordan D. Greenlee, Boise, ID (US);

Scott M. Pook, Meridian, ID (US);

John Mark Meldrim, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 29/10 (2006.01); H01L 23/535 (2006.01); G11C 16/04 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 27/11556 (2017.01); H01L 29/792 (2006.01); H01L 29/788 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); G11C 16/0483 (2013.01); H01L 21/02532 (2013.01); H01L 21/76807 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 23/535 (2013.01); H01L 27/11556 (2013.01); H01L 29/1037 (2013.01); H01L 29/7883 (2013.01); H01L 29/7889 (2013.01); H01L 29/7926 (2013.01);
Abstract

Some embodiments include a conductive structure of an integrated circuit. The conductive structure includes an upper primary portion, with the upper primary portion having a first conductive constituent configured as a container. The container has a bottom, and a pair of sidewalls extending upwardly from the bottom. An interior region of the container is over the bottom and between the sidewalls. The upper primary portion includes a second conductive constituent configured as a mass filling the interior region of the container. The second conductive constituent is a different composition than the first conductive constituent. One or more conductive projections join to the upper primary portion and extend downwardly from the upper primary portion. Some embodiments include assemblies comprising memory cells over conductive structures. Some embodiments include methods of forming conductive structures.


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