The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Apr. 16, 2018
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Shinichi Kuwabara, Ibaraki, JP;

Tetsuya Iida, Ibaraki, JP;

Yasutaka Nakashiba, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/31 (2006.01); H01L 23/528 (2006.01); H01L 23/64 (2006.01); H01L 23/552 (2006.01); H01L 21/8238 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/532 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 21/823871 (2013.01); H01L 23/3114 (2013.01); H01L 23/528 (2013.01); H01L 23/552 (2013.01); H01L 23/645 (2013.01); H01L 24/32 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 21/26513 (2013.01); H01L 21/823878 (2013.01); H01L 21/823892 (2013.01); H01L 23/49541 (2013.01); H01L 23/49551 (2013.01); H01L 23/49575 (2013.01); H01L 23/53228 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06531 (2013.01); H01L 2225/06534 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A compact semiconductor device with an isolator. The semiconductor device includes two chips, namely a first semiconductor chip and a second semiconductor chip which are stacked with the main surfaces of the semiconductor chips partially facing each other. A first coil and a second coil which are formed in the first semiconductor chip and the second semiconductor chip respectively are arranged to face each other so as to be magnetically coupled during operation of the semiconductor device. The pair of first and second coils make up an isolator. The first coil is arranged in a manner to overlap part of the circuit region of the first semiconductor chip in plan view and the second coil is arranged in a manner to overlap part of the circuit region of the second semiconductor chip in plan view.


Find Patent Forward Citations

Kuwabara, Shinichi. (2019). Semiconductor device (U.S. Patent No. 10418321). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10418321

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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