The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Jun. 26, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Bijoyraj Sahu, Portland, OR (US);
Thomas A. Boyd, Vancouver, WA (US);
Jeffory L. Smalley, East Olympia, WA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4093 (2013.01); H01L 21/4882 (2013.01); H01L 23/3672 (2013.01);
Abstract
Described herein are microelectronics packages and methods for manufacturing the same. The microelectronics package may include a substrate, a first die, a gasket, and a thermal interface. The first die may be connected to the substrate. The gasket may be connected to the substrate and may encircle the first die to form a space between the first die and the gasket. The thermal interface material may be located within the space formed by the first die and the gasket.