The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Nov. 21, 2017
Applicant:

Sumitomo Electric Device Innovations, Inc., Yokohama-shi, JP;

Inventor:

Yasuyuki Yamauchi, Yokohama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H01L 23/00 (2006.01); H01S 5/022 (2006.01); H04B 10/2575 (2013.01); H01S 5/026 (2006.01); H01S 5/00 (2006.01); H01S 5/024 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4279 (2013.01); G02B 6/4204 (2013.01); H01L 24/48 (2013.01); H01S 5/0265 (2013.01); H01S 5/02284 (2013.01); H04B 10/2575 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1421 (2013.01); H01S 5/005 (2013.01); H01S 5/02216 (2013.01); H01S 5/02248 (2013.01); H01S 5/02276 (2013.01); H01S 5/02415 (2013.01); H01S 5/02438 (2013.01);
Abstract

A semiconductor module is disclosed. The semiconductor module includes a housing that encloses on a bottom thereof a spacer and a wiring substrate that mounts a semiconductor element thereon. The housing includes a feedthrough that secures one end of a transmission substrate. The other end of the transmission substrate faces the wiring substrate and the spacer. The other end of the transmission substrate provides a lower end and an upper end that form an extension protruding toward the wiring substrate. The upper end is set so close to the wiring substrate but the lower end forms a space for receiving a surplus adhesive oozing between the spacer and the wiring substrate.


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