The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Jul. 11, 2016
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventor:
Hiroshi Yamada, Yamanashi, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 31/28 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2891 (2013.01); H01L 21/68 (2013.01); G01R 31/2865 (2013.01);
Abstract
Provided is a wafer inspection method wherein a chuck top can be properly received. When an aligner receives a chuck top after a wafer W has been inspected, the distance between the chuck top and a chuck base is adjusted by adjusting the inclination of the chuck base such that the chuck top height, which is the distance between the chuck top and the chuck base after the chuck top is held, is a height in which any of 0 to 200 μm is added to the chuck top height before the chuck top is held.