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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10414943 B1

PDFFull Text
Date of Patent:
Sep. 17, 2019

Filed:

Apr. 20, 2016

Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Yoshihiro Takahashi, Ibaraki, JP;

Yasuo Kamigata, Ibaraki, JP;

Hikari Murai, Ibaraki, JP;

Masahiro Aoshima, Ibaraki, JP;

Shinji Tsuchikawa, Ibaraki, JP;

Masato Miyatake, Ibaraki, JP;

Tomohiko Kotake, Ibaraki, JP;

Hiroyuki Izumi, Ibaraki, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, L.L.P.

Primary Examiner:

Seahvosh Nikmanesh

Int. Cl.
CPC ...
H05K 1/03 (2006.01); C09D 163/04 (2006.01); B32B 15/08 (2006.01); B32B 27/04 (2006.01); B32B 27/18 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08K 3/36 (2006.01); C08K 5/3415 (2006.01); C08K 3/22 (2006.01); C08K 3/34 (2006.01); C08K 13/02 (2006.01); C09D 163/00 (2006.01); H05K 3/00 (2006.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C08K 3/013 (2018.01);
U.S. Cl.
CPC ...
C09D 163/04 (2013.01); B32B 15/08 (2013.01); B32B 27/04 (2013.01); B32B 27/18 (2013.01); C08J 5/24 (2013.01); C08K 3/013 (2018.01); C08K 3/22 (2013.01); C08K 3/34 (2013.01); C08K 3/36 (2013.01); C08K 5/3415 (2013.01); C08K 13/02 (2013.01); C08L 63/00 (2013.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C09D 163/00 (2013.01); H05K 1/0306 (2013.01); H05K 1/0373 (2013.01); H05K 3/0047 (2013.01); C08J 2300/24 (2013.01); C08J 2363/00 (2013.01); C08K 2003/2206 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2255 (2013.01); C08K 2003/2296 (2013.01); H05K 1/0366 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0209 (2013.01); Y10T 156/10 (2015.01); Y10T 428/31529 (2015.04); Y10T 428/31678 (2015.04);
Abstract

Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.

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