The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Oct. 18, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Russell T. Herrin, Essex Junction, VT (US);

Jeffrey C. Maling, Grand Isle, VT (US);

Anthony K. Stamper, Burlington, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); B81B 3/00 (2006.01); H01L 41/113 (2006.01); B81C 1/00 (2006.01); H01H 57/00 (2006.01); H01H 1/00 (2006.01); H01H 59/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0072 (2013.01); B81B 3/0021 (2013.01); B81C 1/0015 (2013.01); B81C 1/00365 (2013.01); B81C 1/00476 (2013.01); B81C 1/00619 (2013.01); B81C 1/00626 (2013.01); B81C 1/00666 (2013.01); G06F 17/5068 (2013.01); G06F 17/5072 (2013.01); H01H 1/0036 (2013.01); H01H 57/00 (2013.01); H01H 59/0009 (2013.01); H01L 41/1136 (2013.01); B81B 2201/01 (2013.01); B81B 2201/014 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/04 (2013.01); B81C 2201/013 (2013.01); B81C 2201/017 (2013.01); B81C 2201/0109 (2013.01); B81C 2201/0167 (2013.01); B81C 2203/0136 (2013.01); B81C 2203/0172 (2013.01); H01H 2057/006 (2013.01); H01L 2924/0002 (2013.01); Y10S 438/937 (2013.01); Y10T 29/42 (2015.01); Y10T 29/435 (2015.01); Y10T 29/49002 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/49105 (2015.01); Y10T 29/49121 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/5313 (2015.01);
Abstract

A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.


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