The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Jul. 06, 2015
Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Xiaosheng Su, Guangdong, CN;

Suwen Ye, Guangdong, CN;

Guofang Tang, Guangdong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/28 (2006.01); C09J 183/04 (2006.01); B32B 15/20 (2006.01); B32B 15/08 (2006.01); B32B 27/04 (2006.01); C08J 3/09 (2006.01); H05K 1/03 (2006.01); B32B 15/082 (2006.01); B32B 27/20 (2006.01);
U.S. Cl.
CPC ...
B32B 27/283 (2013.01); B32B 15/08 (2013.01); B32B 15/082 (2013.01); B32B 15/20 (2013.01); B32B 27/04 (2013.01); B32B 27/20 (2013.01); C08J 3/09 (2013.01); C09J 183/04 (2013.01); H05K 1/03 (2013.01); H05K 1/0353 (2013.01); B32B 2307/3065 (2013.01); B32B 2457/08 (2013.01);
Abstract

Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si—H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).


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