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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10411017 B1

PDFFull Text
Date of Patent:
Sep. 10, 2019

Filed:

Aug. 31, 2017

Multi-component conductive structures for semiconductor devices

Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Eric Blomiley, Boise, ID (US);

Fatma Arzum Simsek-Ege, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

Schwegman Lundberg & Woessner, P.A.

Primary Examiner:

Michael M Trinh

Int. Cl.
CPC ...
H01L 21/28 (2006.01); C23C 16/06 (2006.01); H01L 27/108 (2006.01); H01L 29/49 (2006.01); C23C 16/455 (2006.01); H01L 21/768 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10891 (2013.01); C23C 16/06 (2013.01); C23C 16/45527 (2013.01); H01L 21/28079 (2013.01); H01L 21/28088 (2013.01); H01L 21/28556 (2013.01); H01L 21/76846 (2013.01); H01L 29/495 (2013.01); H01L 29/4958 (2013.01); H01L 29/4966 (2013.01);
Abstract

Described are methods for forming multi-component conductive structures for semiconductor devices. The multi-component conductive structures can include a common metal, present in different percentages between the two components of the conductive structures. As described example, multiple components can include multiple ruthenium materials having different percentages of ruthenium. In some applications, at least a portion of one of the ruthenium material components will be sacrificial, and removed in subsequent processing.

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Blomiley, Eric. (2019). Multi-component conductive structures for semiconductor devices (U.S. Patent No. 10411017). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10411017

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