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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10410993 B1

PDFFull Text
Date of Patent:
Sep. 10, 2019

Filed:

Aug. 21, 2018

Manufacturing method of semiconductor device and semiconductor device thereof

Applicant:

Amkor Technology, Inc., Tempe, AZ (US);

Inventors:

Yeong Beom Ko, Gwangju, KR;

Jin Han Kim, Namyangju-si, KR;

Dong Jin Kim, Gwangju, KR;

Do Hyung Kim, Seongnam-si, KR;

Glenn Rinne, Apex, NC (US);

Assignee:

Amkor Technology, Inc., Tempe, AZ (US);

Attorney:

McAndrews, Held & Malloy, Ltd.

Primary Examiner:

S V Clark

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 21/683 (2006.01); H01L 21/311 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/96 (2013.01); H01L 21/311 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/3185 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 23/5384 (2013.01); H01L 23/562 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 24/97 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/1811 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/351 (2013.01);
Abstract

A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.

Find Patent Forward Citations

Ko, Yeong. (2019). Manufacturing method of semiconductor device and semiconductor device thereof (U.S. Patent No. 10410993). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10410993

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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