The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Mar. 31, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jorge A. Alvarez Gonzalez, Zapopan, MX;

Fernando Gonzalez Lenero, Zapopan, MX;

Antonio Zenteno Ramirez, Guadalajara, MX;

Fernando Mendoza Hernandez, Guadalajara, MX;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 1/073 (2006.01); H05K 1/11 (2006.01); G01R 1/04 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07364 (2013.01); G01R 1/0416 (2013.01); H05K 1/115 (2013.01); H01R 2201/20 (2013.01); H05K 3/0047 (2013.01); H05K 2201/09645 (2013.01); H05K 2201/10295 (2013.01);
Abstract

An embodiment includes a system comprising: a polymer substrate including a plurality of voids; and a plurality of metal pins; wherein a first pin, included within the plurality of metal pins, includes: (a)(i) first and second arms that couple to each other by way of an arcuate member, (a)(ii) a middle portion including a middle diameter, a proximal portion including a proximal diameter, and a distal portion including a distal diameter; wherein (b)(i) the middle portion is between the proximal and distal portions, (b)(ii) the middle diameter is less than the proximal and distal diameters, and (b)(iii) the proximal portion, but not the distal portion, is included within one of the plurality of voids. Other embodiments are described herein.


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