The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2019
Filed:
May. 07, 2015
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Honami Nawa, Osaka, JP;
Hirohisa Hino, Osaka, JP;
Arata Kishi, Osaka, JP;
Naomichi Ohashi, Hyogo, JP;
Yasuhiro Suzuki, Osaka, JP;
Hidenori Miyakawa, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08L 23/16 (2006.01); C09D 123/16 (2006.01); C08K 3/34 (2006.01); H05K 7/20 (2006.01); C08L 91/00 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08K 3/34 (2013.01); C08L 23/16 (2013.01); C09D 123/16 (2013.01); H05K 7/205 (2013.01); C08K 2201/003 (2013.01); C08K 2201/016 (2013.01); C08L 91/00 (2013.01);
Abstract
Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 μm to 20 μm; and a filler having a grain diameter of 15 μm or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 μm to 20 μm.