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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10407598 B1

PDFFull Text
Date of Patent:
Sep. 10, 2019

Filed:

Jul. 26, 2016

Workpiece treating method, temporary fixing composition, semiconductor device, and process for manufacturing the same

Applicant:

Jsr Corporation, Tokyo, JP;

Inventors:

Takashi Mori, Tokyo, JP;

Hikaru Mizuno, Tokyo, JP;

Assignee:

JSR CORPORATION, Tokyo, JP;

Attorney:

JCIPRNET

Primary Examiner:

David S Blum

Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01); C09J 161/34 (2006.01); C08G 16/02 (2006.01); C08G 16/04 (2006.01); H01L 21/683 (2006.01); C08G 8/20 (2006.01); C08G 8/30 (2006.01); C08G 8/36 (2006.01); C09J 161/14 (2006.01);
U.S. Cl.
CPC ...
C09J 161/34 (2013.01); C08G 8/20 (2013.01); C08G 8/30 (2013.01); C08G 8/36 (2013.01); C08G 16/0225 (2013.01); C08G 16/04 (2013.01); C09J 161/14 (2013.01); H01L 21/6835 (2013.01); C09J 2205/302 (2013.01); C09J 2205/31 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01);
Abstract

In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece. A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other.

Find Patent Forward Citations

Mori, Takashi. (2019). Workpiece treating method, temporary fixing composition, semiconductor device, and process for manufacturing the same (U.S. Patent No. 10407598). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10407598

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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