The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

May. 24, 2018
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Takashi Sampei, Tokyo, JP;

Yukiyasu Masuda, Tokyo, JP;

Assignee:

Disco Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/08 (2014.01); H01L 21/77 (2017.01); B23K 26/067 (2006.01); B23K 26/359 (2014.01); B23K 26/364 (2014.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0853 (2013.01); B23K 26/067 (2013.01); B23K 26/083 (2013.01); B23K 26/0823 (2013.01); B23K 26/0869 (2013.01); B23K 26/359 (2015.10); B23K 26/364 (2015.10); H01L 21/77 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08);
Abstract

A laser processing apparatus includes a laser oscillator configured to oscillate a laser beam, a first condenser configured to focus an S-polarized laser beam, a second condenser configured to focus a P-polarized laser beam, an X-moving unit configured to processing-feed a holding table that holds a wafer thereon in X directions, and first and second indexing feed units configured to indexing-feed the first and second condensers respectively in Y directions. While the wafer is being processed with the laser beam from the first condenser along a projected dicing line on the wafer in the X directions, the second condenser is indexing-fed and positioned on a next projected dicing line along which to process the wafer.


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