The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Sep. 26, 2018
Applicant:

Kandou Labs, S.a., Lausanne, CH;

Inventor:

Roger Ulrich, Bern, CH;

Assignee:

KANDOU LABS, S.A., Lausanne, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04L 25/03 (2006.01); H04B 3/04 (2006.01); H03K 19/0185 (2006.01); H03K 19/00 (2006.01); H04L 25/49 (2006.01);
U.S. Cl.
CPC ...
H04L 25/03878 (2013.01); H03K 19/0013 (2013.01); H03K 19/0185 (2013.01); H04B 3/04 (2013.01); H04L 25/03133 (2013.01); H04L 25/03343 (2013.01); H04L 25/4917 (2013.01);
Abstract

A plurality of driver slice circuits arranged in parallel having a plurality of driver slice outputs, each driver slice circuit having a digital driver input and a driver slice output, each driver slice circuit configured to generate a signal level determined by the digital driver input, and a common output node connected to the plurality of driver slice outputs and a wire of a multi-wire bus, the multi-wire bus having a characteristic transmission impedance matched to an output impedance of the plurality of driver slice circuits arranged in parallel, each driver slice circuit of the plurality of driver slice circuits having an individual output impedance that is greater than the characteristic transmission impedance of the wire of the multi-wire bus.


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