The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
May. 13, 2016
Applicant:
Momentive Performance Materials Inc., Waterford, NY (US);
Inventors:
Wei Fan, Strongsville, OH (US);
Eelco Galestien, Eijsden-Margraten, NL;
Creighton Tomek, Cleveland, OH (US);
Manjunath Subbanna, Bangalore, IN;
Assignee:
Momentive Performance Materials Inc., Waterford, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 23/373 (2006.01); F21V 29/87 (2015.01); F21S 41/141 (2018.01); F21S 45/47 (2018.01); F21S 41/148 (2018.01); F21Y 101/00 (2016.01); F21Y 115/10 (2016.01); F21Y 107/90 (2016.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); F21S 41/141 (2018.01); F21S 41/148 (2018.01); F21S 45/47 (2018.01); F21V 29/87 (2015.01); H01L 23/373 (2013.01); H01L 33/642 (2013.01); H01L 33/648 (2013.01); F21Y 2101/00 (2013.01); F21Y 2107/90 (2016.08); F21Y 2115/10 (2016.08);
Abstract
A light emitting diode assembly comprising such thermal management assembly is shown and described herein. The light emitting diode assembly may comprise a light emitting diode in thermal contact with a heat spreader. The heat spreader may comprise a core and/or fins. The core and/or fins comprise a thermal pyrolytic graphite material. The thermal management assembly comprising the core and/or fins can dissipate heat from the light emitting diode.