The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Jul. 18, 2017
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Kevin Tetz, Boise, ID (US);
Charles M. Watkins, Eagle, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/64 (2010.01); H01L 33/50 (2010.01); H01L 33/44 (2010.01); H01L 33/52 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/64 (2013.01); H01L 33/44 (2013.01); H01L 33/50 (2013.01); H01L 33/507 (2013.01); H01L 33/52 (2013.01); H01L 33/644 (2013.01); H01L 25/0753 (2013.01); H01L 33/508 (2013.01); H01L 33/641 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0075 (2013.01);
Abstract
Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.