The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Feb. 02, 2018
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventors:
Juntao Li, Cohoes, NY (US);
Kangguo Cheng, Schenectady, NY (US);
Chengwen Pei, Danbury, CT (US);
Geng Wang, Stormville, NY (US);
Joseph Ervin, Wappinger Falls, NY (US);
Assignee:
GLOBALFOUNDRIES INC, Grand Cayman, KY;
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01L 31/0232 (2014.01); H01L 23/48 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); G02B 6/122 (2006.01); H01L 31/02 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02327 (2013.01); G02B 6/122 (2013.01); G02B 6/428 (2013.01); G02B 6/43 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 31/02005 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12123 (2013.01);
Abstract
The present disclosure relates to semiconductor structures and, more particularly, to electrical and optical via connections on a same chip and methods of manufacture. The structure includes an optical through substrate via (TSV) comprising an optical material filling the TSV. The structure further includes an electrical TSV which includes a liner of the optical material and a conductive material filling remaining portions of the electrical TSV.