The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Oct. 17, 2016
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Alexander Viktorovich Bolotnikov, Niskayuna, NY (US);

Ljubisa Dragoljub Stevanovic, Clifton Park, NY (US);

Peter Almern Losee, Clifton Park, NY (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/861 (2006.01); H01L 29/732 (2006.01); H01L 29/808 (2006.01); H01L 29/78 (2006.01); H01L 29/745 (2006.01); H01L 29/739 (2006.01); H01L 29/66 (2006.01); G06F 17/50 (2006.01); H01L 29/16 (2006.01); H01L 23/556 (2006.01); H01L 23/552 (2006.01); H01L 29/872 (2006.01); H01L 29/868 (2006.01);
U.S. Cl.
CPC ...
H01L 29/06 (2013.01); G06F 17/5036 (2013.01); G06F 17/5068 (2013.01); H01L 23/552 (2013.01); H01L 23/556 (2013.01); H01L 29/1608 (2013.01); H01L 29/66068 (2013.01); H01L 29/732 (2013.01); H01L 29/7395 (2013.01); H01L 29/745 (2013.01); H01L 29/7802 (2013.01); H01L 29/7813 (2013.01); H01L 29/8083 (2013.01); H01L 29/861 (2013.01); G06F 2217/06 (2013.01); H01L 29/868 (2013.01); H01L 29/8611 (2013.01); H01L 29/872 (2013.01);
Abstract

In one embodiment, a method of manufacturing a silicon-carbide (SiC) device includes receiving a selection of a specific terrestrial cosmic ray (TCR) rating at a specific applied voltage, determining a breakdown voltage for the SiC device based at least on the specific TCR rating at the specific applied voltage, determining drift layer design parameters based at least on the breakdown voltage. The drift layer design parameters include doping concentration and thickness of the drift layer. The method also includes fabricating the SiC device having a drift layer with the determined drift layer design parameters. The SiC device has the specific TCR rating at the specific applied voltage.


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