The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Jul. 06, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Peter Almern Losee, Clifton Park, NY (US);

Alexander Viktorovich Bolotnikov, Niskayuna, NY (US);

Fabio Carastro, Munich, DE;

Alvaro Jorge Mari Curbelo, Oberschleissheim, DE;

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 29/423 (2006.01); H01L 29/16 (2006.01); H01L 21/8234 (2006.01); H01L 29/78 (2006.01); H01L 27/07 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 21/8234 (2013.01); H01L 21/823437 (2013.01); H01L 21/823475 (2013.01); H01L 23/5228 (2013.01); H01L 23/5286 (2013.01); H01L 29/1608 (2013.01); H01L 29/4238 (2013.01); H01L 29/42316 (2013.01); H01L 29/42372 (2013.01); H01L 29/7802 (2013.01); H01L 27/0738 (2013.01);
Abstract

A gate network of a silicon-carbide (SiC) power conversion device includes a plurality of gate electrodes of SiC metal-oxide-semiconductor-based (MOS-based) transistor device cells disposed in an active area of the SiC power conversion device, and a gate pad disposed in a gate pad and bus area of the SiC power conversion device. The gate network also includes a gate bus disposed in the gate pad and bus area of the SiC power conversion device, wherein the gate bus extends between and electrically connects the gate pad to at least a portion of the plurality of gate electrodes in the active area of the SiC power conversion device. At least a portion of the gate pad, the gate bus, the plurality of gate electrodes, or a combination thereof, of the gate network have a positive temperature coefficient of resistance greater than approximately 2000 parts-per-million per degree Celsius (ppm/° C.).


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