The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2019
Filed:
Sep. 11, 2013
Ebara Corporation, Tokyo, JP;
Kyushu Institute of Technology, Fukuoka, JP;
Hisanori Matsuo, Tokyo, JP;
Keiichi Kimura, Fukuoka, JP;
Keisuke Suzuki, Fukuoka, JP;
Panart Khajornrungruang, Fukuoka, JP;
Takashi Kushida, Fukuoka, JP;
EBARA CORPORATION, Tokyo, JP;
Kyushu Institute of Technology, Fukuoka, JP;
Abstract
The present invention relates to an apparatus for measuring surface properties of a polishing pad which measures surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The apparatus for measuring surface properties of a polishing pad includes a laser beam source configured to emit a laser beam, and a photodetector configured to detect scattered light that is reflected and scattered by the polishing pad, an optical Fourier transform being performed on the detected scattered light to produce an intensity distribution corresponding to a spatial wavelength spectrum based on surface topography of the polishing pad. The laser beam is applied to the polishing pad at such an incident angle that the laser beam does not reach a bottom portion of a pore formed in the surface of the polishing pad.