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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10400099 B1

PDFFull Text
Date of Patent:
Sep. 03, 2019

Filed:

Sep. 08, 2016

Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same

Applicant:

Shengyi Technology Co., Ltd., Guangdong, CN;

Inventors:

Hui Li, Guangdong, CN;

Kehong Fang, Guangdong, CN;

Yongjing Xu, Guangdong, CN;

Assignee:

SHENGYI TECHNOLOGY CO., LTD., , CN;

Attorney:

McDonald Hopkins LLC

Primary Examiner:

Kregg T Brooks

Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 27/38 (2006.01); B32B 15/092 (2006.01); B32B 27/04 (2006.01); B32B 27/18 (2006.01); C08G 59/42 (2006.01); C08G 59/40 (2006.01); C08G 59/50 (2006.01); C08G 73/06 (2006.01); C08J 5/04 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08L 63/08 (2006.01); C08L 35/06 (2006.01); C08L 79/04 (2006.01); C08F 222/08 (2006.01); H01B 3/40 (2006.01); C08K 13/02 (2006.01); C08G 59/62 (2006.01); C08G 73/02 (2006.01); C08G 14/06 (2006.01); C08L 61/34 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B32B 15/092 (2013.01); B32B 27/38 (2013.01); C08G 59/40 (2013.01); C08G 59/42 (2013.01); C08G 59/4238 (2013.01); C08G 59/4284 (2013.01); C08G 59/5046 (2013.01); C08G 59/621 (2013.01); C08G 73/0233 (2013.01); C08G 73/06 (2013.01); C08J 5/043 (2013.01); C08J 5/24 (2013.01); C08K 13/02 (2013.01); C08L 35/06 (2013.01); C08L 63/08 (2013.01); C08L 79/04 (2013.01); H01B 3/40 (2013.01); H05K 1/0373 (2013.01); C08G 14/06 (2013.01); C08J 2363/00 (2013.01); C08J 2363/02 (2013.01); C08J 2363/08 (2013.01); C08L 61/34 (2013.01); C08L 2201/02 (2013.01); C08L 2201/22 (2013.01); C08L 2203/20 (2013.01); C08L 2205/02 (2013.01); C08L 2205/05 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); H05K 1/0366 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0212 (2013.01); H05K 2201/0242 (2013.01);
Abstract

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

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