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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10400086 B1

PDFFull Text
Date of Patent:
Sep. 03, 2019

Filed:

Jan. 28, 2016

Thermal expandability adjuster, use as thermal expandability adjuster, thermoset resin composition, insulating material, sealing material and conductive paste each containing thermoset resin composition, cured products, prepreg and member obtained by curing thermoset resin composition of prepreg, method of adjusting thermal expansion rate, and member manufactured using method of adjusting

Applicant:

Air Water Inc., Hokkaido, JP;

Inventors:

Yousuke Ebihara, Ibaraki, JP;

Osamu Koyama, Ibaraki, JP;

Assignee:

AIR WATER INC., Hokkaido, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Vu A Nguyen

Int. Cl.
CPC ...
C08G 59/32 (2006.01); C08G 59/40 (2006.01); C08G 59/62 (2006.01); C08K 5/3445 (2006.01); C08J 5/24 (2006.01); C08G 59/26 (2006.01); H01L 23/14 (2006.01); C07D 487/04 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); C08J 5/18 (2006.01); H01L 23/29 (2006.01); H01B 1/20 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
C08K 5/3445 (2013.01); C07D 487/04 (2013.01); C08G 59/26 (2013.01); C08G 59/32 (2013.01); C08J 5/18 (2013.01); C08J 5/24 (2013.01); H01L 23/14 (2013.01); H01L 23/293 (2013.01); H05K 1/0271 (2013.01); H05K 1/0346 (2013.01); H05K 1/0373 (2013.01); C08J 2300/24 (2013.01); C08J 2363/00 (2013.01); H01B 1/20 (2013.01); H01L 23/295 (2013.01); H05K 1/095 (2013.01); H05K 2201/068 (2013.01);
Abstract

A thermal expandability adjuster is provided which contains a glycoluril derivative compound represented by formula (1) below. The thermal expandability adjuster can reduce the linear thermal expansion coefficient of a cured product of a thermoset resin composition used for an insulating resin layer or the like and is effective for suppressing deformation of a circuit substrate due to heating. Compounding the above thermal expandability adjuster can reduce the linear thermal expansion coefficient of a cured product obtained by curing a thermoset resin composition and it is therefore possible to provide a member that exhibits small deformation due to heat.

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