The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Sep. 28, 2015
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Chi-fan Chen, Taichung, TW;

Wan-chun Chen, Zhubei, TW;

Yu-chih Lin, Taoyuan, TW;

Tze Yuan Wang, New Taipei, TW;

Chia-yuan Liu, Yangmei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); A61B 5/145 (2006.01); H05K 3/06 (2006.01); B41M 1/26 (2006.01); B41M 1/12 (2006.01); B41C 1/00 (2006.01); A61B 5/15 (2006.01); H05K 1/03 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00388 (2013.01); A61B 5/14532 (2013.01); B41M 1/26 (2013.01); B81C 1/00 (2013.01); B81C 1/00206 (2013.01); B81C 1/00396 (2013.01); H05K 3/061 (2013.01); A61B 5/150022 (2013.01); A61B 5/150274 (2013.01); A61B 5/150358 (2013.01); A61B 2562/0295 (2013.01); A61B 2562/125 (2013.01); B01J 2219/00382 (2013.01); B41C 1/003 (2013.01); B41M 1/12 (2013.01); B81C 2201/01 (2013.01); H01L 21/4867 (2013.01); H05K 1/0393 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/1545 (2013.01);
Abstract

A master tool is provided with an ink pattern on a major surface thereof. The ink pattern is formed by a screen printing process. A stamp-making material is applied to the major surface of the master tool to form a stamp having a stamping pattern being negative to the ink pattern of the master tool. The stamping pattern is inked with an ink composition and contacted with a metalized surface to form a printed pattern on a metalized surface of a substrate according to the stamping pattern. Using the printed pattern as an etching mask, the metalized surface is etched to form electrically conductive traces on the substrate.


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