The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2019

Filed:

Oct. 06, 2015
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Christopher David Offensend, Seattle, WA (US);

Kirk Ben Kajita, Newcastle, WA (US);

Kieran P. Davis, Seattle, WA (US);

Matthew R. Soja, Seattle, WA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B64C 1/06 (2006.01); B64C 3/18 (2006.01); B29C 53/02 (2006.01); B29C 53/80 (2006.01); B29C 70/56 (2006.01); B29C 70/34 (2006.01); B29C 70/44 (2006.01); B29D 99/00 (2010.01); B29C 70/22 (2006.01); B64F 5/10 (2017.01); B29L 31/00 (2006.01); B29L 31/30 (2006.01); B64C 1/00 (2006.01);
U.S. Cl.
CPC ...
B29C 70/34 (2013.01); B29C 53/02 (2013.01); B29C 53/80 (2013.01); B29C 70/222 (2013.01); B29C 70/44 (2013.01); B29C 70/56 (2013.01); B29D 99/0003 (2013.01); B64C 1/06 (2013.01); B64C 3/18 (2013.01); B64F 5/10 (2017.01); B29L 2031/001 (2013.01); B29L 2031/3082 (2013.01); B29L 2031/7502 (2013.01); B64C 2001/0072 (2013.01); Y02T 50/43 (2013.01);
Abstract

A contoured composite laminate stiffener is fabricated by assembling a substantially flat composite laminate charge and forming the charge into a substantially straight stiffener having a desired cross sectional shape. A contour is formed in the stiffener which has an inside radius and an outside radius. Ply wrinkling is substantially eliminated by reducing compression strain on the inside radius as the stiffener as being contoured.


Find Patent Forward Citations

Loading…