The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Mar. 08, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Ravi Shankar, Chandler, AZ (US);

Ching-Ping Janet Shen, Gilbert, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/30 (2006.01); B32B 5/02 (2006.01); B32B 7/12 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 17/06 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/38 (2006.01); B32B 37/12 (2006.01); B32B 37/24 (2006.01); B32B 37/26 (2006.01); B32B 38/10 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 3/025 (2013.01); B32B 3/30 (2013.01); B32B 5/02 (2013.01); B32B 7/12 (2013.01); B32B 15/043 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 17/06 (2013.01); B32B 27/20 (2013.01); B32B 27/283 (2013.01); B32B 27/38 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H05K 1/038 (2013.01); H05K 1/09 (2013.01); H05K 3/022 (2013.01); B32B 2037/243 (2013.01); B32B 2037/268 (2013.01); B32B 2255/06 (2013.01); B32B 2255/10 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2270/00 (2013.01); B32B 2305/076 (2013.01); B32B 2305/08 (2013.01); B32B 2307/202 (2013.01); B32B 2307/748 (2013.01); B32B 2311/12 (2013.01); B32B 2315/085 (2013.01); B32B 2363/00 (2013.01); B32B 2383/00 (2013.01); B32B 2457/08 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68345 (2013.01); H05K 3/0097 (2013.01); H05K 2203/06 (2013.01); Y10T 156/10 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/24942 (2015.01);
Abstract

Generally discussed herein are systems and apparatuses that can include a base with one or more recesses therein. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include providing a releasable core, the releasable core including a first conductive foil integrally coupled with a base at a first side of the base and a first side of the conductive foil, the first conductive foil situated in a first recess in the first side of the base. The technique can include releasably coupling a second conductive foil to a second side of the first conductive foil through a temporary adhesive layer integrally coupled to a first side of the second conductive foil, the second side of the first conductive foil opposite the first side of the first conductive foil.


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