The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Sep. 06, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Sohyeon Lee, Suwon-si, KR;

Sunil Shim, Seoul, KR;

Jaeduk Lee, Seongnam-si, KR;

Jaehoon Jang, Seongnam-si, KR;

Jeehoon Han, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11565 (2017.01); H01L 27/1157 (2017.01); H01L 27/11582 (2017.01); H01L 23/52 (2006.01); H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11565 (2013.01); H01L 21/76816 (2013.01); H01L 21/76877 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 27/1157 (2013.01); H01L 27/11582 (2013.01);
Abstract

A three-dimensional semiconductor device and a method of manufacturing the same are provided. The three-dimensional semiconductor device includes a stack structure including insulating layers and electrodes that are alternately stacked on a substrate, a horizontal semiconductor pattern between the substrate and the stack structure, vertical semiconductor patterns penetrating the stack structure and connected to the horizontal semiconductor pattern; and a common source plug at a side of the stack structure. The stack structure, the horizontal semiconductor pattern and the common source plug extend in a first direction. The horizontal semiconductor pattern includes a first sidewall extending in the first direction. The first sidewall has protrusions protruding toward the common source plug.


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