The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Nov. 20, 2017
Applicant:

Sumitomo Electric Device Innovations, Inc., Yokohama-shi, Kanagawa, JP;

Inventors:

Yuichi Hasegawa, Yokohama, JP;

Naoyuki Miyazawa, Yokohama, JP;

Assignee:

SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC., Yokohama-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/528 (2006.01); H03F 1/56 (2006.01); H01L 23/522 (2006.01); H01L 23/367 (2006.01); H01L 49/02 (2006.01); H03F 3/195 (2006.01); H03F 3/213 (2006.01); H01L 23/36 (2006.01); H01L 23/482 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/4824 (2013.01); H01L 23/528 (2013.01); H01L 23/66 (2013.01); H01L 28/60 (2013.01); H03F 1/565 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H03F 2200/222 (2013.01); H03F 2200/225 (2013.01); H03F 2200/387 (2013.01); H03F 2200/391 (2013.01); H03F 2200/451 (2013.01);
Abstract

A semiconductor device that outputs a radio-frequency (RF) signal with high power is disclosed. The semiconductor device includes a housing, a semiconductor chip, an impedance converter, a capacitor, and a bonding wire. The housing includes a heat sink, an output lead terminal, and a bias terminal electrically isolated from the output lead terminal. The semiconductor chip is mounted on the heat sink of the housing. The impedance converter provides an input port, an output port, and an intermediate port between the input port and the output port thereof. The capacitor is mounted on the heat sink and between the impedance converter and the output lead terminal. The bonding wire connects the bias lead terminal with the intermediate port.


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