The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Dec. 16, 2015
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Shintaro Iida, Naka, JP;

Reiko Izumi, Osaka, JP;

Hideaki Sakurai, Amagasaki, JP;

Ken Hayashii, Arida, JP;

Keiko Ashida, Amagasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/295 (2006.01); H01B 7/29 (2006.01); H01B 3/30 (2006.01); H01B 3/44 (2006.01); H01B 3/10 (2006.01); H01B 7/02 (2006.01);
U.S. Cl.
CPC ...
H01B 7/292 (2013.01); H01B 3/10 (2013.01); H01B 3/30 (2013.01); H01B 3/306 (2013.01); H01B 3/44 (2013.01); H01B 3/447 (2013.01); H01B 7/02 (2013.01); H01B 7/29 (2013.01);
Abstract

The present invention provides an insulated wire having a heat-resistant insulating layer, wherein heat-resistant particles are contained in the insulating layer, and the heat-resistant particles are densely dispersed in a surface region of the insulating layer. For example, the concentration of heat-resistant particles included in a layer thick portion of 0.5 μm from the surface of the insulating layer is two times the concentration of heat-resistant particles included in a central portion of the insulating layer. An electrodeposition liquid used to form the insulating layer is formed by dispersing the heat-resistant particles in a suspension in which resin particles are dispersed, the viscosity is 100 cP or less, and the turbidity is 1 mg/L or more.


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