The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Jun. 22, 2016
Applicant:

Freescale Semiconductor Inc., Austin, TX (US);

Inventors:

Peter T. Jones, Scottsdale, AZ (US);

Arvind Salian, Chandler, AZ (US);

William D. McWhorter, Goodyear, AZ (US);

Chad Krueger, Tempe, AZ (US);

John Shipman, Tempe, AZ (US);

Michael Naumann, Chandler, AZ (US);

Larry D. Metzler, Phoenix, AZ (US);

Tripti Regmi, Tempe, AZ (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01M 7/08 (2006.01); B81C 99/00 (2010.01);
U.S. Cl.
CPC ...
G01M 7/08 (2013.01); B81C 99/005 (2013.01); B81C 99/0045 (2013.01); B81B 2201/0235 (2013.01);
Abstract

Methods and apparatuses are provided for evaluating or testing stiction in Microelectromechanical Systems (MEMS) devices utilizing a mechanized shock pulse generation approach. In one embodiment, the method includes the step or process of loading a MEMS device, such as a multi-axis MEMS accelerometer, into a socket provided on a Device-Under-Test (DUT) board. After loading the MEMS device into the socket, a series of controlled shock pulses is generated and transmitted through the MEMS device utilizing a mechanized test apparatus. The mechanized test apparatus may, for example, repeatedly move the DUT board over a predefined motion path to generate the controlled shock pulses. In certain cases, transverse vibrations may also be directed through the tested MEMS device in conjunction with the shock pulses. An output of the MEMS device is then monitored to determine whether stiction of the MEMS device occurs during each of the series of controlled shock pulses.


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