The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Mar. 24, 2017
Applicants:

Ngk Insulators, Ltd., Nagoya, JP;

Ngk Adrec Co., Ltd., Kani-Gun, JP;

Tokyo Institute of Technology, Tokyo, JP;

Inventors:

Shinichi Miwa, Nagoya, JP;

Toshiharu Kinoshita, Kani-Gun, JP;

Iori Himoto, Kani-Gun, JP;

Yukitaka Kato, Tokyo, JP;

Jun Kariya, Tokyo, JP;

Assignees:

NGK Insulators, Ltd., Nagoya, JP;

NGK Adrec Co., Ltd., Kani-Gun, JP;

Tokyo Institute of Technology, Meguro-Ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 20/00 (2006.01); C09K 5/16 (2006.01);
U.S. Cl.
CPC ...
F28D 20/003 (2013.01); C09K 5/16 (2013.01); F28D 2020/0017 (2013.01); Y02E 60/142 (2013.01);
Abstract

A heat storage member including a substrate containing a SiC sintered body as a principal ingredient and a heat storage material configured to store and radiate heat by a reversible chemical reaction with a reaction medium or a heat storage material configured to store and radiate heat by physical adsorption to a reaction medium and physical desorption from a reaction medium. The substrate has a three-dimensional network structure including a skeleton having porosity of 1% or less. A void ratio of a void formed in the three-dimensional network structure of the substrate is ranging from 30 to 95%. The heat storage material is disposed at least in a part of a surface of the void in the three-dimensional network structure of the substrate.


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