logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10391694 B1

PDFFull Text
Date of Patent:
Aug. 27, 2019

Filed:

Dec. 22, 2014

Method of producing film

Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Keisuke Hatano, Osaka, JP;

Yutaka Fujiwara, Osaka, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:

Osha Liang LLP

Primary Examiner:

Mathieu D Vargot

Int. Cl.
CPC ...
B29D 11/00 (2006.01); B29C 47/14 (2006.01); B29C 48/30 (2019.01); B29C 48/305 (2019.01); B29C 48/08 (2019.01); B29C 48/00 (2019.01); C08J 5/18 (2006.01); B29K 21/00 (2006.01); B29K 101/12 (2006.01); B29K 105/16 (2006.01); B29L 7/00 (2006.01); B29L 11/00 (2006.01); B29K 421/00 (2006.01);
U.S. Cl.
CPC ...
B29C 48/30 (2019.02); B29C 48/022 (2019.02); B29C 48/08 (2019.02); B29C 48/305 (2019.02); B29D 11/00788 (2013.01); C08J 5/18 (2013.01); B29K 2021/003 (2013.01); B29K 2101/12 (2013.01); B29K 2105/16 (2013.01); B29K 2421/00 (2013.01); B29K 2995/0026 (2013.01); B29L 2007/008 (2013.01); B29L 2011/00 (2013.01); C08J 2333/12 (2013.01); C08J 2333/14 (2013.01); C08J 2351/00 (2013.01); C08J 2351/04 (2013.01); C08J 2351/06 (2013.01); C08J 2419/00 (2013.01); C08J 2433/12 (2013.01); C08J 2433/14 (2013.01); C08J 2451/00 (2013.01); C08J 2451/04 (2013.01); C08J 2451/06 (2013.01);
Abstract

Disclosed herein is a method of producing a film, the method being capable of suppressing formation of die lines in melt extrusion molding using a T die. A thermoplastic resin composition having a relaxation modulus of not less than 100 Pa and not more than 2,000 Pa is melted and kneaded, the relaxation modulus being measured under conditions of a temperature of 260° C., distortion of 1%, and a relaxation time of 1 second, and extrusion molding of the thermoplastic resin composition using the T die is performed to form the film. The thermoplastic resin composition may contain an acrylic resin and a rubber particle.

Find Patent Forward Citations

Loading…