The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Mar. 30, 2015
Senju Metal Industry Co., Ltd., Tokyo, JP;
Manabu Muraoka, Tochigi, JP;
Takeo Saitoh, Tochigi, JP;
Shigeyuki Sekine, Tochigi, JP;
Takashi Obayashi, Tochigi, JP;
Kaichi Tsuruta, Tochigi, JP;
Takashi Hagiwara, Tochigi, JP;
Hiroyuki Yamasaki, Tochigi, JP;
Kota Kikuchi, Tokyo, JP;
Naoto Kameda, Tochigi, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.