The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2019
Filed:
Feb. 20, 2018
Fuji Electric Co., Ltd., Kanagawa, JP;
Eri Ogawa, Matsumoto, JP;
Yuichi Onozawa, Matsumoto, JP;
Kazutoshi Sugimura, Okaya, JP;
Hiroyuki Tanaka, Matsumoto, JP;
Kota Ohi, Matsumoto, JP;
Yoshihiro Ikura, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Abstract
The position of the side wall of a metal electrode is precisely controlled and the coverage of a layer above the metal electrode is improved. A semiconductor device is provided, including: a semiconductor substrate; and a metal electrode formed above an upper surface of the semiconductor substrate, wherein a side wall of the metal electrode includes a lower portion contacting the semiconductor substrate, and an upper portion that is formed upper than the lower portion and has a smaller inclination relative to the upper surface of the semiconductor substrate than the lower portion. An active region formed in the semiconductor substrate is further included, and the metal electrode may be a field plate formed on an outer side relative to the active region on the upper surface of the semiconductor substrate. The upper portion of the side wall of the field plate may have an upward-convex shape.