The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Oct. 04, 2017
Applicant:

Vanguard International Semiconductor Corporation, Hsinchu, TW;

Inventors:

Chien-Wei Chiu, Beigang Township, TW;

Shin-Cheng Lin, Tainan, TW;

Yu-Hao Ho, Keelung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/822 (2006.01); H01L 27/06 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 21/8238 (2006.01); H01L 21/8234 (2006.01); H01L 21/8249 (2006.01); H01L 29/66 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0623 (2013.01); H01L 21/8249 (2013.01); H01L 21/823481 (2013.01); H01L 21/823493 (2013.01); H01L 21/823878 (2013.01); H01L 21/823892 (2013.01); H01L 29/0653 (2013.01); H01L 29/1083 (2013.01); H01L 29/66659 (2013.01); H01L 29/66681 (2013.01); H01L 29/7816 (2013.01); H01L 29/7835 (2013.01);
Abstract

A semiconductor device includes a semiconductor substrate having a first conductivity type, wherein the semiconductor substrate includes a first region and a second region. The semiconductor device also includes a buried layer disposed in the first region of the semiconductor substrate and having the first conductivity type, wherein the buried layer has a dopant concentration that is greater than that of the semiconductor substrate. The semiconductor device further includes an epitaxial layer disposed on the semiconductor substrate, and a first element disposed on the first region of the semiconductor substrate, wherein the first element includes a bipolar-complementary metal oxide semiconductor (CMOS)-double diffused metal oxide semiconductor (DMOS) (BCD) transistor. In addition, the semiconductor device includes a second element disposed on the second region of the semiconductor substrate, wherein the second element includes an ultra-high voltage (UHV) transistor.


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