The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Sep. 28, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jothilingam Ramalingam, Sunnyvale, CA (US);

Ross Marshall, Campbell, CA (US);

Jianxin Lei, Fremont, CA (US);

Xianmin Tang, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/285 (2006.01); H01L 29/49 (2006.01); H01L 21/02 (2006.01); H01L 29/66 (2006.01); H01L 21/786 (2006.01); H01L 29/78 (2006.01); C23C 14/14 (2006.01); C23C 14/58 (2006.01); C23C 14/50 (2006.01); C23C 14/34 (2006.01); H01L 21/768 (2006.01); C23C 14/18 (2006.01); C23C 14/35 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28518 (2013.01); C23C 14/14 (2013.01); C23C 14/185 (2013.01); C23C 14/34 (2013.01); C23C 14/35 (2013.01); C23C 14/50 (2013.01); C23C 14/5806 (2013.01); H01L 21/02532 (2013.01); H01L 21/7685 (2013.01); H01L 29/4933 (2013.01); H01L 29/6656 (2013.01); H01L 29/78 (2013.01); H01L 21/6833 (2013.01);
Abstract

Ruthenium containing gate stacks and methods of forming ruthenium containing gate stacks are described. The ruthenium containing gate stack comprises a polysilicon layer on a substrate; a silicide layer on the polysilicon layer; a barrier layer on the silicide layer; a ruthenium layer on the barrier layer; and a spacer layer comprising a nitride on sides of the ruthenium layer, wherein the ruthenium layer comprises substantially no ruthenium nitride after formation of the spacer layer. Forming the ruthenium layer comprises sputtering the ruthenium in a krypton environment on a high current electrostatic chuck comprising a high resistivity ceramic material. The sputtered ruthenium layer is annealed at a temperature greater than or equal to about 500° C.


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