The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2019
Filed:
Aug. 29, 2018
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Masahiro Kyozuka, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi, JP;
Abstract
An electronic component device includes a first coreless wiring substrate, an electronic component mounted on the first coreless wiring substrate, a second coreless wiring substrate disposed above the first coreless wiring substrate and the electronic component such that the second coreless wiring substrate is spaced from the first coreless wiring substrate and the electronic component, a connection terminal that connects the first coreless wiring substrate and the second coreless wiring substrate, and a sealing resin filled between the first and second coreless wiring substrates. Each of the first and second coreless wiring substrates include an insulating layer, a wiring layer, and a reinforcing layer embedded in the insulating layer and provided in a region overlaying the electronic component.