The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Mar. 07, 2018
Applicant:

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Markus Leitgeb, Trofaiach, AT;

Heinz Moitzi, Zeltweg, AT;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/46 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); H01L 21/4857 (2013.01); H01L 23/5385 (2013.01); H05K 1/0271 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 3/0061 (2013.01); H05K 3/4038 (2013.01); H05K 3/429 (2013.01); H05K 3/4608 (2013.01); H05K 3/4614 (2013.01); H05K 3/4644 (2013.01); H05K 3/4688 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); H05K 3/4611 (2013.01); H05K 3/4632 (2013.01); H05K 3/4673 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/096 (2013.01);
Abstract

A hybrid component carrier is manufactured by providing a first layer structure having at least one electrically insulating layer and at least one electrically conductive layer; and forming a second layer structure on the first layer structure where the second layer structure includes at least a first layer and a second layer. The first layer structure has a first density of electrically conductive elements. The second layer structure has a second density of electrically conductive elements that is greater than the first density of electrically conductive elements. The forming of the second layer structure on the first layer structure includes forming the first layer of the second layer structure on the first layer structure; and subsequently forming the second layer of the second layer structure on the first layer of the second layer structure.


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