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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10381504 B1

PDFFull Text
Date of Patent:
Aug. 13, 2019

Filed:

May. 03, 2018

Wafer level packaging, optical detection sensor and method of forming same

Applicant:

Stmicroelectronics Pte Ltd, Singapore, SG;

Inventors:

Yonggang Jin, Singapore, SG;

Wee Chin Judy Lim, Singapore, SG;

Assignee:

STMicroelectronics Pte Ltd, Singapore, SG;

Attorney:

Crowe & Dunlevy

Primary Examiner:

Georgia Y Epps

Assistant Examiner:

Don J Williams

Int. Cl.
CPC ...
H01L 31/16 (2006.01); H01L 31/0232 (2014.01); H01L 31/18 (2006.01); H03K 17/94 (2006.01); H03K 17/96 (2006.01); H01L 31/167 (2006.01); G01S 17/02 (2006.01); G01S 7/481 (2006.01); H01L 25/16 (2006.01); G01V 8/12 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 31/16 (2013.01); G01S 7/4813 (2013.01); G01S 17/026 (2013.01); H01L 25/167 (2013.01); H01L 31/0232 (2013.01); H01L 31/02327 (2013.01); H01L 31/167 (2013.01); H01L 31/18 (2013.01); H01L 31/186 (2013.01); H03K 17/941 (2013.01); H03K 17/9631 (2013.01); H03K 17/9638 (2013.01); G01V 8/12 (2013.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/18 (2013.01); H01L 2224/19 (2013.01); H01L 2924/3511 (2013.01); H03K 2217/96023 (2013.01); Y10T 156/1052 (2015.01); Y10T 156/1064 (2015.01);
Abstract

An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.

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