The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2019
Filed:
Sep. 27, 2017
Applicant:
International Busniess Machines Corporation, Armonk, NY (US);
Inventors:
Emre Alptekin, Wappingers Falls, NY (US);
Albert M. Chu, Nashua, NH (US);
Eric Eastman, Lagrangeville, NY (US);
Myung-Hee Na, Lagrangeville, NY (US);
Ravikumar Ramachandran, Pleasantville, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/8234 (2006.01); H01L 21/285 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/785 (2013.01); H01L 21/28518 (2013.01); H01L 21/823431 (2013.01); H01L 29/66795 (2013.01); H01L 29/7845 (2013.01); H01L 2029/7858 (2013.01);
Abstract
A method for manufacturing a semiconductor device comprises forming a plurality of fins in an active region, forming a plurality of gates around the plurality of fins in the active region, forming one or more gate contacts in the active region, and forming a plurality of contacts to source/drain regions in the active region.