The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Jan. 03, 2017
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Shing-Yih Shih, New Taipei, TW;

Shih-Fan Kuan, Taoyuan, TW;

Tieh-Chiang Wu, Taoyuan, TW;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 49/02 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 24/03 (2013.01); H01L 24/09 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 28/60 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/0401 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/18161 (2013.01);
Abstract

An interposer includes a first redistribution layer, an organic substrate, a capacitor, a hard mask layer, a conductive pillar, and a second redistribution layer. The organic substrate is on the first redistribution layer. The capacitor is embedded in the organic substrate and includes a first electrode layer, a second electrode layer, and a capacitor dielectric layer between the first electrode layer and the second electrode layer. The first electrode layer electrically connects with the first redistribution layer. The hard mask layer is on the organic substrate. The conductive pillar is embedded in the organic substrate and the hard mask layer and electrically connects with the first redistribution layer. The second redistribution layer is on the hard mask layer and electrically connects with the second electrode layer and the conductive pillar.


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