The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Aug. 21, 2018
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Koji Watanabe, Nagano, JP;

Kentaro Kaneko, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 21/4825 (2013.01); H01L 21/4828 (2013.01); H01L 21/4832 (2013.01); H01L 21/561 (2013.01); H01L 23/49541 (2013.01); H01L 23/49582 (2013.01); H01L 24/33 (2013.01); H01L 23/49548 (2013.01); H01L 23/49572 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49112 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/85005 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/18165 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A lead frame includes a plate portion provided with a first surface and a second surface, the second surface being opposite to the first surface; a protruding portion integrally formed with the plate portion to be protruded from the first surface of the plate portion, wherein a surface of the lead frame includes a work affected layer existing region at which a work affected layer is formed, and a work affected layer non-existing region at which a work affected layer is not formed, wherein a front end surface of the protruding portion is the work affected layer existing region, wherein a region of the first surface at which the protruding portion is not formed is the work affected layer non-existing region, and wherein the second surface of the plate portion includes the work affected layer non-existing region.


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